MediaTek has announced the launch of its latest chipset, the Dimensity 9200+, expanding its portfolio for flagship 5G smartphones. This new chipset offers significant performance upgrades while maintaining power efficiency, allowing for longer battery life and better gaming experiences.
The Dimensity 9200+ features an ultra-core Arm Cortex-X3 operating at up to 3.35GHz, three Arm Cortex-A715 super-cores running up to 3.0GHz, and four Arm Cortex-A510 efficiency cores at 2.0GHz, supporting higher clock speeds than its predecessor. MediaTek has also enhanced the chipset’s Arm Immortalis-G715 GPU by 17% for better gaming and other compute-intensive applications.
In addition to its processing power, the Dimensity 9200+ also boasts a 4CC-CA 5G Release-16 modem, allowing for seamless switching between long-reach sub-6GHz and super-fast mmWave connections. The chipset supports Wi-Fi 7 2×2 + 2×2 with up to 6.5Gbps data rate and Bluetooth 5.3, with MediaTek’s Bluetooth and Wi-Fi coexistence technology ensuring low latency and no interference.
Other key features of the MediaTek Dimensity 9200+ include HyperEngine 6.0 for adaptive gaming performance, a second-generation TSMC 4nm-class process for slim designs, a sixth-generation AI Processing Unit (APU 690), MediaTek Imagiq 890 for powerful image signal processing, MediaTek MiraVision 890 ↗ for display technology and MediaTek 5G UltraSave 3.0 for power efficiency optimization.
Smartphones powered by the MediaTek Dimensity 9200+ are expected to be released in May 2023, offering users an enhanced mobile experience with its impressive processing power and efficient performance.
